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Smart card or Special chip modules production

Smart card or Special chip modules production

  • Dynacard is the leading manufacturer of smart card packaging and manufacturing in Taiwan.

  • With excellent IC packaging technology, one or more bare chips can be bonded with flexible circuit boards of different substrates by wire bonding.

  • From wafer grinding and sawing to module packaging services, combining card printing and module embedding, with complete card production service, provides customers with one-stop high quality service.

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Type of products offered:

(1)contact/contact-less/dual-interface module

(6pin/8pin/MFF22 (QFN8)/DFN6/MOA2/MOA4/Multichip package).

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(2)Thin SIM sticker module:

4FF(Nano SIM card) size, and the thin SIM sticker module is only thickness range 0.18~0.2mm.When the high-security chip is attached to the SIM card, it can be used with biometric identification such as the built-in fingerprint of the mobile phone that you must take when you go out which adding double authentication protection.

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(3)Mold SIM:

​A new generation of smart cards; environmental protection, 5G networking, only 4FF card size, leaving the extra PVC card body, small size, saving freight cost, and M2M high temperature resistance.

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(4)Package of bracket module such as pressure sensor:

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(5)Provide personalized service of modules

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