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LGA Memory Card Module Package 

LGA Memory Card Module Package 

  • LGA (Land Grid Array) is a planar grid array package, which is applied to High speed logic LSI circuit.

  • The bottom surface is fabricated with an array state electrode contact package, and when assembling, Just plug it into the socket.

  • There are 227 contacts (1.27 mm center distance) and 447 contacts (2.54 mm center distance).

  • GA can accommodate more input in a smaller package than QFP Input and output pins.

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