Smart card or Special chip modules production
Smart card or Special chip modules production
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Dynacard is the leading manufacturer of smart card packaging and manufacturing in Taiwan.
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With excellent IC packaging technology, one or more bare chips can be bonded with flexible circuit boards of different substrates by wire bonding.
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From wafer grinding and sawing to module packaging services, combining card printing and module embedding, with complete card production service, provides customers with one-stop high quality service.
Type of products offered:
(1)contact/contact-less/dual-interface module
(6pin/8pin/MFF22 (QFN8)/DFN6/MOA2/MOA4/Multichip package).
(2)Thin SIM sticker module:
4FF(Nano SIM card) size, and the thin SIM sticker module is only thickness range 0.18~0.2mm.When the high-security chip is attached to the SIM card, it can be used with biometric identification such as the built-in fingerprint of the mobile phone that you must take when you go out which adding double authentication protection.
(3)Mold SIM:
A new generation of smart cards; environmental protection, 5G networking, only 4FF card size, leaving the extra PVC card body, small size, saving freight cost, and M2M high temperature resistance.
(4)Package of bracket module such as pressure sensor:
(5)Provide personalized service of modules