TSOP (Thin Small Outline Package), that is, thin and small-size package.

The typical feature of TSOP is to make pins around the package chip.

Suitable for mounting wiring on PCB (Printed Circuit Board) using SMT technology (Surface Mount Technology).

​TSOP package size, parasitic parameters (large current changes, resulting in output voltage disturbance) is reduced, suitable for high frequency applications, easy to operate, high reliability.