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LGA Memory Card Module Package
LGA Memory Card Module Package
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LGA (Land Grid Array) is a planar grid array package, which is applied to High speed logic LSI circuit.
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The bottom surface is fabricated with an array state electrode contact package, and when assembling, Just plug it into the socket.
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There are 227 contacts (1.27 mm center distance) and 447 contacts (2.54 mm center distance).
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GA can accommodate more input in a smaller package than QFP Input and output pins.


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